Title:
POSITIVE TYPE PHOTORESIST COMPOSITION FOR EXPOSURE WITH FAR ULTRAVIOLET RAY
Document Type and Number:
Japanese Patent JP2001194786
Kind Code:
A
Abstract:
To provide a positive type photoresist composition which solves the problem of the occurrence of development defects and scum in development in micro-photofabrication using far ultraviolet light and which is capable of giving a resist pattern excellent in adhesion to a substrate.
The positive type photoresist composition for exposure with far UV contains (A) a compound which generates an acid when irradiated by active light or radiation and (B) a polymer containing an alicyclic structure in the principal chain and having an adamantane structure in a side chain.
Inventors:
ADEGAWA YUTAKA
SATO KENICHIRO
KODAMA KUNIHIKO
AOSO TOSHIAKI
SATO KENICHIRO
KODAMA KUNIHIKO
AOSO TOSHIAKI
Application Number:
JP31740799A
Publication Date:
July 19, 2001
Filing Date:
November 08, 1999
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
H01L21/027; C08F222/00; C08F232/00; G03F7/004; G03F7/039; (IPC1-7): G03F7/039; C08F222/00; C08F232/00; G03F7/004; H01L21/027
Attorney, Agent or Firm:
Shohei Oguri (7 outside)