Title:
POSITIVE TYPE PHOTORESIST COMPOSITION
Document Type and Number:
Japanese Patent JP2001194787
Kind Code:
A
Abstract:
To provide a positive type photoresist composition which ensures improved edge roughness of a resist pattern in the production of a semiconductor device and is excellent in preservability at room temperature and in line density dependency.
The positive type photoresist composition contains (A) an acid generating compound represented by a specified structure, (B) an acid decomposable resin containing at least specified silicon-containing repeating units or repeating units with a specified structure and having solubility to an alkali developing solution increased by the action of the acid and (C) a specified solvent.
Inventors:
SATO KENICHIRO
MIZUTANI KAZUYOSHI
MIZUTANI KAZUYOSHI
Application Number:
JP2000001894A
Publication Date:
July 19, 2001
Filing Date:
January 07, 2000
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/039; C08F220/00; C08F230/08; C08K5/00; C08K5/06; C08K5/07; C08K5/101; C08K5/109; C08K5/15; C08K5/151; C08L43/04; G03F7/004; G03F7/075; H01L21/027; (IPC1-7): G03F7/039; C08F220/00; C08F230/08; C08K5/00; C08K5/06; C08K5/07; C08K5/101; C08K5/109; C08K5/151; C08L43/04; G03F7/004; G03F7/075; H01L21/027
Attorney, Agent or Firm:
Shohei Oguri (6 outside)