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Title:
POSITIVE TYPE PHOTORESIST COMPOSITION
Document Type and Number:
Japanese Patent JP2001356481
Kind Code:
A
Abstract:

To attain a controlled thermal flow in a contact hole (via hole) in a resist.

The objective positive type resist composition contains one or more components which are preferably substantially stable 1) in soft baking which is a heat treatment before exposure for removing the solvent carrier of an applied resist and 2) in a heat treatment after exposure and before development for accelerating or increasing an acceleration reaction by an acid in an exposed region (typically a deblocked region). The resist is crosslinked in a more intense heat treatment (thermal flow hard baking) after development.


Inventors:
TIMOTHY G ADAMS
Application Number:
JP2001104371A
Publication Date:
December 26, 2001
Filing Date:
April 03, 2001
Export Citation:
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Assignee:
SHIPLEY CO LLC
International Classes:
C08K5/00; C08L101/00; G03F7/004; G03F7/039; G03F7/40; H01L21/027; G03F7/028; (IPC1-7): G03F7/039; C08K5/00; C08L101/00; G03F7/004; G03F7/40; H01L21/027
Domestic Patent References:
JPH07111241A1995-04-25
JP2000356850A2000-12-26
JPH09211864A1997-08-15
JPH10268508A1998-10-09
JPH09292709A1997-11-11
JP2001337457A2001-12-07
JP2001188341A2001-07-10
JP2001142199A2001-05-25
Attorney, Agent or Firm:
Minoru Senda (2 outside)



 
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