Title:
POSITIVE TYPE PHOTORESIST COMPOSITION
Document Type and Number:
Japanese Patent JP2001356481
Kind Code:
A
Abstract:
To attain a controlled thermal flow in a contact hole (via hole) in a resist.
The objective positive type resist composition contains one or more components which are preferably substantially stable 1) in soft baking which is a heat treatment before exposure for removing the solvent carrier of an applied resist and 2) in a heat treatment after exposure and before development for accelerating or increasing an acceleration reaction by an acid in an exposed region (typically a deblocked region). The resist is crosslinked in a more intense heat treatment (thermal flow hard baking) after development.
Inventors:
TIMOTHY G ADAMS
Application Number:
JP2001104371A
Publication Date:
December 26, 2001
Filing Date:
April 03, 2001
Export Citation:
Assignee:
SHIPLEY CO LLC
International Classes:
C08K5/00; C08L101/00; G03F7/004; G03F7/039; G03F7/40; H01L21/027; G03F7/028; (IPC1-7): G03F7/039; C08K5/00; C08L101/00; G03F7/004; G03F7/40; H01L21/027
Domestic Patent References:
JPH07111241A | 1995-04-25 | |||
JP2000356850A | 2000-12-26 | |||
JPH09211864A | 1997-08-15 | |||
JPH10268508A | 1998-10-09 | |||
JPH09292709A | 1997-11-11 | |||
JP2001337457A | 2001-12-07 | |||
JP2001188341A | 2001-07-10 | |||
JP2001142199A | 2001-05-25 |
Attorney, Agent or Firm:
Minoru Senda (2 outside)