Title:
粉体充填装置および粉体充填方法
Document Type and Number:
Japanese Patent JP5070120
Kind Code:
B2
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Inventors:
Oka Taira
Emi Oikawa
Emi Oikawa
Application Number:
JP2008122346A
Publication Date:
November 07, 2012
Filing Date:
May 08, 2008
Export Citation:
Assignee:
Kii Sangyo Co., Ltd.
International Classes:
B65B39/00; B65B1/04; B65B37/00
Domestic Patent References:
| JP60158001A | ||||
| JP2004307042A | ||||
| JP2006306485A |
Attorney, Agent or Firm:
Hitoshi Fukui