Title:
POWER TYPE HYBRID INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JPS5679457
Kind Code:
A
Abstract:
PURPOSE: To reduce heat resistance by bonding a het dissipating block for a heating element on a metal heat dissipating plate with a ceramic substrate, piercing a hole in the substrate.
CONSTITUTION: A ceramic substrate 18 with a hole 17 and a power transistor 19 to be fitted into the hole 17 are bonded on an Al heat dissipating plate with an insulating adhesive. An epoxy adhesive sheet 20 is used to seal bond a case 21 with the ceramic substrate 18, and an epoxy resin 23 is injected and hardened to reinforce an external lead 22. This reduces heat resistance to obtain a power type by brid IC with a high reliability.
Inventors:
AOKI HIDEAKI
TAKEHANA AKIRA
HIROTA MINORU
TAKEHANA AKIRA
HIROTA MINORU
Application Number:
JP15713079A
Publication Date:
June 30, 1981
Filing Date:
December 03, 1979
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L23/40; H01L23/02; H01L25/16; (IPC1-7): H01L23/02; H01L23/40