Title:
PREPREG, LAMINATE AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2018012792
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition and a prepreg having high heat resistance, low relative dielectric constants, high metal foil adhesiveness, a high glass transition temperature and low thermal expansibility, and also excellent moldability and plating uniformity, and also provide a laminate and a printed wiring board.SOLUTION: A prepreg contains a thermosetting resin composition containing (A) a maleimide compound, (B) an epoxy resin, (C) a copolymer resin containing a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, and (D) silica treated with an amino silane coupling agent.SELECTED DRAWING: None
Inventors:
SHIRAOKAWA YOSHIKATSU
KAKIYA MINORU
YANAGIDA MAKOTO
KUSHIDA KEISUKE
KANEKO TATSUNORI
KAKIYA MINORU
YANAGIDA MAKOTO
KUSHIDA KEISUKE
KANEKO TATSUNORI
Application Number:
JP2016143651A
Publication Date:
January 25, 2018
Filing Date:
July 21, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08J5/24; B32B15/08; C08G59/42; C08L63/00; H05K1/03
Domestic Patent References:
| JP6701630B2 | 2020-05-27 | |||
| JP2016033195A | 2016-03-10 | |||
| JP2016017091A | 2016-02-01 | |||
| JP2016060780A | 2016-04-25 |
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kosuke Sawayama
Kenichi Hirasawa
Kosuke Sawayama