Title:
PRESS-BONDING DEVICE
Document Type and Number:
Japanese Patent JP2002234017
Kind Code:
A
Abstract:
To provide a press-bonding device which can form a laminated body having a uniform thickness.
This press-bonding device is equipped with an upper die 10 and a lower die 8 to form the laminated body 12, a pressing means which pinches the upper die 10 and the lower die 8 and applies a pressure, and a vertically sliding mechanism which vertically moves the pressing means. Then, the laminated body 12 is formed while curving at least one of the upper die 10 and the lower die 8.
Inventors:
NAKAJIMA HIDEO
Application Number:
JP2001034920A
Publication Date:
August 20, 2002
Filing Date:
February 13, 2001
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B30B15/02; B28B11/00; (IPC1-7): B28B11/00; B30B15/02
Domestic Patent References:
| JPS61169211A | 1986-07-30 | |||
| JPH02238902A | 1990-09-21 |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)