Title:
PRESSURE-SENSITIVE ADHESIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3157256
Kind Code:
B2
Abstract:
PURPOSE: To provide a compsn. which has low melt viscosity, excellent pressure- sensitive adhesive properties (tack, peeling strength, and holding power), and thermal stability necessary for a hot-melt adhesive and is useful as a pressure- sensitive adhesive in the field of hygienic materials.
CONSTITUTION: This compsn. is prepd. by compounding 100 pts.wt. polymer component consisting of two partially hydrogenated block copolymers with 40-400 pts.wt. tackifier. One of the copolymers has at least two polymer blocks (A) mainly comprising arom. vinyl compd. units and at least one polymer block (B) mainly comprising conjugated diene units, and the other has a polymer block (C) mainly comprising arom. vinyl compd. units and at least one polymer block (D) mainly comprising conjugated diene units. In both the copolymers, 35% or lower of the conjugated diene part is hydrogenated and vinyl bonds in the conjugated diene part is 3% or lower.
Inventors:
Hiroshi Yanagihara
Shigeo Nakashima
Shigeo Nakashima
Application Number:
JP6279592A
Publication Date:
April 16, 2001
Filing Date:
March 19, 1992
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
C09J153/02; C09J153/00; (IPC1-7): C09J153/02
Domestic Patent References:
| JP21788A | ||||
| JP2153987A | ||||
| JP6420284A |
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