Title:
PRESSURE-SENSITIVE ADHESIVE SHEET, ITS MANUFACTURING METHOD AND PROCESSING METHOD OF PRODUCT
Document Type and Number:
Japanese Patent JP2006232930
Kind Code:
A
Abstract:
To provide a pressure-sensitive adhesive sheet used for processing a product such as a semiconductor wafer and reducing warping of the product caused by residual stress of the adhesive sheet without staining or breaking the semiconductor wafer etc. during processing.
The pressure-sensitive adhesive sheet has an intermediate layer and an adhesive layer in this order on one side of a substrate having a tensile modulus at 25°C of ≥600 MPa. The intermediate layer is an acrylic polymer layer having a tensile modulus at 25°C of 1-100 MPa.
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Inventors:
AKAZAWA MITSUHARU
YOSHIDA YOSHITOKU
KONYA TOMOHIRO
YANO KOHEI
YOSHIDA YOSHITOKU
KONYA TOMOHIRO
YANO KOHEI
Application Number:
JP2005047505A
Publication Date:
September 07, 2006
Filing Date:
February 23, 2005
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
C09J7/02; B32B27/30
Domestic Patent References:
| JP2001203255A | 2001-07-27 | |||
| JP2005019518A | 2005-01-20 | |||
| JP2004054008A | 2004-02-19 | |||
| JP2004341155A | 2004-12-02 | |||
| JP2004107644A | 2004-04-08 | |||
| JP2005019666A | 2005-01-20 |
Attorney, Agent or Firm:
Yumiko Oshima