To solve a problem in a manufacturing process of an electronic part in which static electricity is apt to be collected in the electronic part due to an excessively increased surface resistance value after heating and foaming of an adhesive layer, and this static electricity often affects the performance of the electronic part.
The pressure-sensitive adhesive tape for temporary fixing of electronic part includes at least a support base material film and a thermally expandable adhesive layer provided on one surface thereof. The thermally expandable adhesive layer includes thermally expandable microspheres and an ionic liquid. The content of the ionic liquid is 0.01-10 pts.wt. relative to 100 pts.wt. of a polymer contained in the thermally expandable adhesive layer, while the surface resistance of the adhesive layer is 1.0×1013 Ω/SQUARE or less, and the change rate of surface resistance before and after foaming heating is 5.0 times or less.
SHIMOKAWA DAISUKE
HIRAYAMA TAKAMASA
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児玉 喜博
山田 泰之
長谷部 善太郎