Pressure-sensitive adhesives, especially for encapsulation of electronic devices

Title:

Pressure-sensitive adhesives, especially for encapsulation of electronic devices

Document Type and Number:

Japanese Patent JP6307079

Kind Code:

B2

Abstract:

Pressure-sensitive adhesive material for encasing an electronic arrangement to prevent permeate, which material comprises at least 70 percent by weight of a mixture of at least one fluorine-containing thermoplastic elastomer and at least one fluorine-containing liquid elastomer, wherein the mass ratio of the fluorine-containing liquid elastomer to the fluorine-containing thermoplastic elastomer is between 5:95 to 55:45.

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Inventors:

Kaite-Tergenviewer Klaus
Elinger Yang

Application Number:

JP2015527819A

Publication Date:

April 04, 2018

Filing Date:

July 04, 2013

Export Citation:

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Assignee:

Theza Societas Europe

International Classes:

C09J127/12; C09J7/20; C09J11/04; C09J11/06; C09J11/08

Domestic Patent References:

JP3072552A
JP2006001363A1

Foreign References:

US4647157

Attorney, Agent or Firm:

Mitsufumi Esaki
Blacksmith
Katsunori Uenishi
Ichiro Torayama

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