To provide a mounting structure for a pressure sensor for preventing a pressure detection accuracy from being lowered due to an ambient temperature change or a tightening torque of a package.

A wire bonding pad 64 is arranged on one side of an element board 61, the back side of the pad 64 is bonded by an adhesive, and the element board 61 is fixed to the package in an open side manner. A bonding part 16 of the element board 61 is arranged near the center of the package. Since an area of the bonding part 16 is small, an influence by a stress due to the ambient temperature change is reduced. Since the area of the bonding part 16 is small so as to be arranged and installed near the center of the package, an influence by the tightening torque for a mounting operation is reduced.