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Title:
PRIMER, ELECTROCONDUCTOR FOIL WITH RESIN, LAMINATED PLATE AND METHOD OF PRODUCING LAMINATED PLATE
Document Type and Number:
Japanese Patent JP2009132929
Kind Code:
A
Abstract:

To provide a resin primer which can adhere sufficiently strongly an insulator layer and an electroconductor foil with relatively small coarseness, and to provide an electroconductor foil with a resin, a laminated plate and a method for producing the same.

The resin primer has an ability to form a film and contains a resin having a fracture energy of at least 0.15 J. Also, the electroconductor foil with the resin includes an electroconductor foil and a resin layer consisting of the resin primer. Further, the laminated plate is provided with the electroconductor foil, an insulator layer placed opposite to the electroconductor foil and the resin layer placed between the electroconductor foil and the insulator layer contacting them. The laminated plate can be produced by heating and pressurizing the electroconductor foil with the resin and a laminate provided with a prepreg laminated on the resin layer.


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Inventors:
TANAKA KENJI
TAKEUCHI KAZUMASA
OGAWA NOBUYUKI
MASUDA KATSUYUKI
Application Number:
JP2008318803A
Publication Date:
June 18, 2009
Filing Date:
December 15, 2008
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09D5/00; B32B15/088; C08G73/14; C09D121/00; C09D179/08; C09J121/00; C09J179/08; H05K1/03; H05K3/38; H05K3/46
Domestic Patent References:
JPH1121454A1999-01-26
JPH1121455A1999-01-26
JPH07126386A1995-05-16
JPH08113646A1996-05-07
JPH08113647A1996-05-07
JPH08231721A1996-09-10
JPH11335652A1999-12-07
JPH10265760A1998-10-06
JPH11263912A1999-09-28
JP2003292930A2003-10-15
JP2001011420A2001-01-16
JP2001011421A2001-01-16
JP2000239640A2000-09-05
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu



 
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