To provide a print mask manufacturing method capable of suppressing significant disruption in a print pattern due to low removal performance of a print material from a through hole while avoiding the disruption in the shape of a through hole due to irradiation of laser for half-etching processes.
When a material having a thickness of about 150 μm is used as a substrate 2, after a half-etching portion 3 is subjected to a laser processing, the substrate 2 is turned over, and laser is irradiated from the side opposite to the side used in a half etching processing so as to form through holes 4. On the other hand, when a material having a thickness of about 75 μm is used, the substrate 2 is irradiated with laser from the same side with the half-etching portion 3 and the through holes 4 at the same time.
| JPS58133442 | 【考案の名称】謄写原紙用印字装置 |
| JP3411801 | INK TRANSFER PRINTER |
NAKAMURA SHOJI
YOKOYAMA TAKASHI
TANAKA EIJI
| JPH11129640A | 1999-05-18 | |||
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