Title:
PRINTED BOARD
Document Type and Number:
Japanese Patent JPH04320389
Kind Code:
A
Abstract:
PURPOSE: To obtain a printed board which can be easily molded along a sewing line at the time of dividing by holding the board to be divided rigidly from manufacture of the board, mounting and to an end of soldering.
CONSTITUTION: A board 6 in which a tool can be easily inserted and removed at a sewing line 3, is provided, the tool is inserted from a punched window of the board to cut connecting parts 4a, 4b for rigidly connecting separate boards 1, 2, and the board is divided along the line 3.
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Inventors:
ASAGI OSAMU
Application Number:
JP8874491A
Publication Date:
November 11, 1992
Filing Date:
April 19, 1991
Export Citation:
Assignee:
SONY CORP
International Classes:
H05K1/02; H05K3/00; (IPC1-7): H05K1/02
Attorney, Agent or Firm:
Hidekuma Matsukuma
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