Title:
プリント回路基板の製造方法
Document Type and Number:
Japanese Patent JP7390800
Kind Code:
B2
Abstract:
To provide a printed circuit board, a manufacturing method thereof, and a printed wiring board which can improve the reliability of a joint.SOLUTION: A main board 3 and a sub board 21 are used for a three-dimensional printed circuit board 1. A slit 5 and a main substrate electrode 7 are formed on the main substrate 3. The sub board 21 includes a main body portion 21a and an insertion portion 21b. A sub board electrode 23 and a solder resist processing portion 25 are formed in the insertion portion 21b. The sub board electrode 25 is formed so as to extend from the tip end of insertion main surfaces 21ba and 21bb toward the side of the main body portion 21a. The solder resist processing unit 25 extends in a direction away from the tip, and covers the portion of the sub board electrode 23 by using the tip of the insertion main surfaces 21ba and 21b as start.SELECTED DRAWING: Figure 4
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Inventors:
Shunsuke Sasaki
Kohei Satoh
Kohei Satoh
Application Number:
JP2019083794A
Publication Date:
December 04, 2023
Filing Date:
April 25, 2019
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H05K1/14; H05K3/34
Domestic Patent References:
| JP2010258190A | ||||
| JP2018107389A | ||||
| JP5048262A | ||||
| JP2003142791A | ||||
| JP60194367U |
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office
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