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Title:
PRINTED WIRING BOARD, CONNECTION STRUCTURE THEREOF, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2007149889
Kind Code:
A
Abstract:

To provide a printed wiring board capable of preventing occurrence of a migration while preventing occurrence of a short circuit due to solder bridges or the like.

A plurality of connection terminals 12A are respectively provided with an exposed connection region 14. A groove 15 is formed in an insulating substrate 11 between the connection regions 14 excluding a part near the end edge of a resist layer 13 in the connection region 14 and a region in which the connection terminals 12A are formed, so as to lengthen a creeping distance between the connection terminals 12A. Consequently, it is possible to prevent occurrence of the short circuit while preventing formation of the solder bridges between the connection terminals 12A when soldered.


Inventors:
TAKAGI RYOTARO
NIKAIDO SHINICHI
Application Number:
JP2005341036A
Publication Date:
June 14, 2007
Filing Date:
November 25, 2005
Export Citation:
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Assignee:
FUJIKURA LTD
International Classes:
H05K1/14
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Shunichi Takahashi