Title:
PRINTED WIRING BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3471046
Kind Code:
B2
Abstract:
PURPOSE: To provide the title manufacturing method having high bond properties of copper plating onto aluminum as well as printed wiring board by a method wherein electroless nickel plating step as preprocessing is performed in order to copper-plate the aluminum of an inermediate layer circuit of multilayered printed wiring board using the aluminum on a part of a conductor.
CONSTITUTION: Copper foil circuits 3 are formed on both surface and rear surface of a resin laminated board 2 containing multilayered aluminum intermediate layer circuits 1. Before the formation of a through hole copper plating layer 6 from the through hole 4 inner wall surface of this laminated board to the surface and rear surface layer, an electroless nickel plating layer 5 as an underneath layer is formed. Due to the adoption of the electroless nickel plating as the underneath layer of the copper electroplating having the bond properties onto both aluminum and copper plating, excellent copper plating is to be made feasible. Especially, the bond properties can be furthermore enhanced by removing the oxide film on the aluminum surface before the electrolytic nickel plating step as well as substituting the aluminum surface with nickel under strong acidity.
Inventors:
Keiji Arai
Application Number:
JP20065193A
Publication Date:
November 25, 2003
Filing Date:
August 12, 1993
Export Citation:
Assignee:
富士通株式会社
International Classes:
H05K3/24; C23C18/32; H05K3/26; H05K3/42; H05K3/46; H05K1/09; (IPC1-7): H05K3/24; C23C18/32
Domestic Patent References:
| JP575238A |
Attorney, Agent or Firm:
Shoichi Ui (3 others)
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