Title:
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP3328630
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To propose a printed wiring board excellent in connection reliability wherein position deviation does not exist in formation of a viahole between layers and a conductor circuit, and a manufacturing method of the printed wiring board.
SOLUTION: A recessed part is formed by laser in an interlayer resin insulating layer 40 which is arranged on a metal layer 34 on which a roughened surface 34β is formed. In this case, a positioning mark 46 is formed by eliminating the roughened surface 34β of the metal layer 34 which is exposed from a lower part of the recessed part by using laser. When reflection type image processing is performed, difference of contrast between the positioning mark 46 and the other part is large, so that the positioning mark 46 can be exactly recognized. Thereby the conductor circuit can be formed with a high position precision.
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Inventors:
Yougo Kawasaki
Kazuo Iwai
Satoshi Kurokawa
Kazuo Iwai
Satoshi Kurokawa
Application Number:
JP2000060328A
Publication Date:
September 30, 2002
Filing Date:
March 06, 2000
Export Citation:
Assignee:
IBIDEN Co., Ltd.
International Classes:
G03F7/40; B23K26/382; G03F7/20; G03F9/00; H05K1/02; H05K3/06; H05K3/18; H05K3/46; B23K101/42; (IPC1-7): H05K3/46; B23K26/00; G03F9/00; H05K1/02; H05K3/06; H05K3/18
Domestic Patent References:
| JP1140908A |
Attorney, Agent or Firm:
Akito Tagashita (1 person outside)