Title:
PRINTED WIRING BOARD AND MOTOR COIL SUBSTRATE
Document Type and Number:
Japanese Patent JP2022033423
Kind Code:
A
Abstract:
To provide a printed wiring board and a motor coil substrate with high connection reliability.SOLUTION: A printed wiring board 201 includes a flexible material 22 having a first surface F and a second surface S on the opposite side of the first surface F, a first conductor circuit 51 formed on the first surface F, a second conductor circuit 52 formed on the second surface S, and a via conductor VA that penetrates the flexible material 22 and connects the first conductor circuit 51 and the second conductor circuit 52. The first conductor circuit 51, the second conductor circuit 52, and the via conductor VA form a one-turn coil, and the shape of the via conductor VA on the first surface F is a pentagon.SELECTED DRAWING: Figure 2
Inventors:
MORITA HARUHIKO
MIWA HITOSHI
KATO SHINOBU
YOKOMAKU TOSHIHIKO
KATO HISASHI
HIRASAWA TAKAHISA
MURAKI TETSUYA
FURUNO TAKAYUKI
MIWA HITOSHI
KATO SHINOBU
YOKOMAKU TOSHIHIKO
KATO HISASHI
HIRASAWA TAKAHISA
MURAKI TETSUYA
FURUNO TAKAYUKI
Application Number:
JP2020137298A
Publication Date:
March 02, 2022
Filing Date:
August 17, 2020
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H01F5/00; H01F17/00; H01P9/02; H05K1/16; H05K3/46
Attorney, Agent or Firm:
Akito Tagashita
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