Title:
PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2006324377
Kind Code:
A
Abstract:
To provide a printed wiring board in which stripping strength of a substrate and a component mounting land can be enhanced drastically and good soldering can be performed with extremely high reliability.
A via is formed directly under a component mounting land formed larger than the soldering area. On the component mounting land, solder resist is removed over an area equal to the soldering area and rides over the periphery of the component mounting land or a part thereof. Overriding amount is set to absorb the slippage for the circuit pattern when the solder resist is formed.
Inventors:
UEHARA HAJIME
Application Number:
JP2005144989A
Publication Date:
November 30, 2006
Filing Date:
May 18, 2005
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K3/34; H05K1/11; H05K3/28
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito
Tomoyasu Sakaguchi
Hiroki Naito
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