Title:
PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP3847578
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a printed wiring board that is highly reliable enough to efficiently prevent noise generating in a power system conductor and to cause no reduction in part mounting area due to the preventive measures or no increase in cost due to the increased number of mounting parts, that can increase inductance elements to make an impedance to high-frequency element high, and in which a DC. component is made as a conductor for the same potential connection and a high-frequency component is made as a separated conductor.
SOLUTION: A plurality of island-like power system solid conductor layers 21 and 22 that are separated for each of part mounting areas are formed on one surface of a printed board 1, and a GND solid conductor layer 3 is entirely formed on the opposite surface thereof.
Inventors:
Yuichi Sasaki
Application Number:
JP2001168513A
Publication Date:
November 22, 2006
Filing Date:
June 04, 2001
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H05K1/02; H05K1/16; (IPC1-7): H05K1/02; H05K1/16
Domestic Patent References:
| JP7046748B2 | ||||
| JP2090587A | ||||
| JP2001127396A | ||||
| JP9092940A | ||||
| JP9181454A |
Attorney, Agent or Firm:
Hiroaki Tazawa
Konobu Kato
Konobu Kato