PURPOSE: To increase the mounting density and the economic efficiency thereof as well as the yield by a method wherein, within the printed wiring board for mounting a 100-pin surface mounted integrated circuit, the space of region including inspecting lands is to be specified not to exceed a specified cm2

CONSTITUTION: The title printed wiring board mounted with 100-pin surface mounted integrated circuit at the 0.5mm terminal pitch is provided with the lines 2 in line in width not exceeding 0.25mm, the inspecting lands 3 arranged in 2.54mm lattice close to respective pins of the surface mounted integrated circuit as well as a pattern in the space of region not exceeding l4.52cm2 including the inspecting lands 3, the lines 2 in width of 0.25mm connecting the inspecting lands 3 to an integrated circuit connecting pad 1 at the minimum gap of the circuit of 0.25mm, the lines 2 and the integrated circuit connecting pad 1.