Title:
PROBE CARD
Document Type and Number:
Japanese Patent JP3249865
Kind Code:
B2
Abstract:
PURPOSE: To provide a probe card capable of mounting probes with high density and of locating an externally attached circuit such as a bypass capacitor closely to a semiconductor wafer.
CONSTITUTION: Wiring is laid on the upper surface of a probe board 4, a probe 5 is bent downward at an almost outer peripheral edge of a positioning hole 4a from the upper surface of a probe board 4 and, moreover, the probe is further bent in the direction of a central part of the positioning hole 4a. Length of the probe 5 and the bending angle can be varied. An externally attached circuit 8 is provided on the top surface of the probe board 4, and this circuit 8 is electrically connected to the wiring.
Inventors:
Katsumi Kotake
Application Number:
JP25554693A
Publication Date:
January 21, 2002
Filing Date:
October 13, 1993
Export Citation:
Assignee:
株式会社日立製作所
日立北海セミコンダクタ株式会社
日立北海セミコンダクタ株式会社
International Classes:
G01R1/073; H01L21/66; G01R31/26; (IPC1-7): H01L21/66; G01R1/073; G01R31/26
Domestic Patent References:
| JP1296167A | ||||
| JP63114551U | ||||
| JP333070U |
Attorney, Agent or Firm:
Yamato Tsutsui
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