To maintain high cleaning capability, without rotating a wafer at the time of cleaning after being developed, and further to restrict the quantity of cleaning solution consumed.
A charged rod 173, which moves on a wafer W retained by a chuck 120, is provided in a developing device 30. Developer is filled on the wafer W, and if a prescribed time period has passed, the charged rod 173 is charged with reverse electric charges to those of a processing products in the developer, while being moved in the developer on the wafer W. When this takes place, the processing products in the developer are gathered by the charged rod 173 by static electricity. As a result, thereafter, even if the cleaning solution for the wafer W is supplied with non-rotatingly, a small quantity is used for the cleaning solution, the wafer W can be cleaned sufficiently.
Miaki Kametani
Koji Hagiwara