To minimize the influence on an upstream side processing part of a substrate to be processed even when a process flow is congested in a part inside a system.
In an oven tower (TB) 44 on the upstream side, heating units (DHP) 51, 52 and an adhesion unit (AD) 54 are stacked in multiple stages on a carrying-in pass unit (PASS) 50, and a buffer unit (BUF) 66 is arranged on the uppermost stage of the tower. In an oven tower (TB) 48 on the downstream side, cooling units (COL) 59, 60 and an adhesion unit (AD) 62 are stacked in multiple stages on a carrying-out pass unit (PASS) 58, and a buffer unit (BUF) 66 is arranged on the uppermost stage of the tower. A carrying mechanism 46 accesses an optional unit in both neighboring oven towers (TB) 44, 48 by up/down or rotating motion to carry in/out the substrate.
MURAKAMI TAKAHITO
Next Patent: QUANTUM COMPUTING ELEMENT