PROPYLENE HOMOPOLYMER FOR STRESS DURABILITY MOLDING, COMPOSITION INCLUDING THE SAME, AND STRESS DURABILITY MOLDING OBTAINED THEREFROM

Japanese Patent JP2014040599

A

To provide a propylene-based polymer used for an automobile component, a housing related component, a consumer electronics component, and an electric power tool component which are used under the situation where stress applies for a long time, to provide a propylene resin composition containing the polymer, and to provide a stress durability molding obtained therefrom.

A propylene homopolymer (A) satisfies following requirements (1) to (5) and a propylene resin composition contains the propylene homopolymer (A). (1) A ratio (Mw/Mn) of a weight average molecular weight (Mw) and a number average molecular weight (Mn) measured by GPC is in the range of 1.2 to 3.5, (2) Mn is in the range of 35,000 to 400,000, (3) a content of component soluble to o-dichlorobenzene at 90°C is 4 wt.% or less, (4) A melting point (Tm) is 155°C or higher, and (5) a melt flow rate measured at a temperature of 230°C and a load of 2.16 kg is 0.1 to 50 (g/10 min.).

WO/1998/004600	HIGHLY CRYSTALLINE POLYPROPYLENE
WO/2022/055234	POWDER-TYPE POLYPROPYLENE RESIN AND METHOD FOR PREPARING SAME
JP2001064322	PROPYLENE POLYMER AND ITS MOLDED ARTICLE, AND PRODUCTION OF PROPYLENE POLYMER

ITAKURA KEITA
ISHII TOSHIYUKI
ONISHI MICHIO
HASHIZUME SATOSHI

JP2013212910A

March 06, 2014

October 10, 2013

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PRIME POLYMER CO LTD
MITSUI CHEMICALS INC

C08F110/06; B29C45/00; B29C45/14; C08K7/02; C08L23/08; C08L23/12

JPH0732401A	1995-02-03
JP2006274114A	2006-10-12
JP2006057010A	2006-03-02
JP2006249167A	2006-09-21
JP2002284817A	2002-10-03
JP5390194B2	2014-01-15

Patent corporation ssinpat

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