Title:
保護テープ貼付け装置
Document Type and Number:
Japanese Patent JP4450696
Kind Code:
B2
Abstract:
In a method for allowing a cutter blade to relatively travel along an outer periphery of a semiconductor wafer to cut a protective tape joined to a surface of the semiconductor wafer in conformity with an outer shape of the semiconductor wafer, the cutter blade is allowed to relatively travel along the outer periphery of the semiconductor wafer with a positioning notch provided on the outer periphery thereof. The cutter blade is rotationally turned at the fore half of the notch recessed on the outer periphery of the semiconductor wafer during the relative travel of the cutter blade in such a manner that its blade tip is directed toward the center of the wafer. In contrast, the cutter blade is rotationally turned at the rear half of the notch in such a manner that its blade tip is directed toward the outer periphery of the semiconductor wafer.
Inventors:
Masayuki Yamamoto
Norio Mori
Nishinohama Kenshi
Atsushi Ogawa
Norio Mori
Nishinohama Kenshi
Atsushi Ogawa
Application Number:
JP2004239502A
Publication Date:
April 14, 2010
Filing Date:
August 19, 2004
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
B26D3/10; B26D3/14
Domestic Patent References:
| JP2004122242A | ||||
| JP63300892A | ||||
| JP2004025438A |
Attorney, Agent or Firm:
Tsutomu Sugiya