Title:
PURGING MATERIAL AND PURGING METHOD USING THE MATERIAL
Document Type and Number:
Japanese Patent JP2008279623
Kind Code:
A
Abstract:
To provide a purging material which is excellent in discharging/removing a thermally degraded resin sticking to the wall surface of a molding machine and has good purging efficiency, and a purging method.
The purging material comprises a water-containing resin prepared by blending a thermoplastic resin and water in a resin/water ratio (weight ratio) of 30/70-70/30 as a main component. The thermoplastic resin is preferably a saponified ethylene-vinyl ester copolymer. By passing the purging material through the molding machine with the temperature of the melting domain of the molding machine set at 80-120C, water contained in the purging material is supplied efficiently to a resin to be purged to make it be discharged easily.
Inventors:
ONISHI HIDEFUMI
IRIE JUNJI
GOSHIMA KUNIHIKO
HIRAMATSU TAKANOBU
IRIE JUNJI
GOSHIMA KUNIHIKO
HIRAMATSU TAKANOBU
Application Number:
JP2007124135A
Publication Date:
November 20, 2008
Filing Date:
May 09, 2007
Export Citation:
Assignee:
NIPPON SYNTHETIC CHEM IND
International Classes:
B29C47/08; B29C33/72; B29C45/17; C08K3/20; C08L31/02; C08L101/00
Domestic Patent References:
| JPH10180867A | 1998-07-07 | |||
| JPH08244042A | 1996-09-24 | |||
| JPH08207081A | 1996-08-13 | |||
| JPH1170538A | 1999-03-16 |
Attorney, Agent or Firm:
Eriko Kamiya