To provide a quality control method of a grinding wheel in grinding work, capable of detecting a grinding mark caused by a fixed abrasive grain of a large grain size.

While determining the reference surface area of silicon powder in silicon sludge generated when grinding a grinding object by a reference grinding wheel, the measured surface area of the silicon powder in the silicon sludge generated when grinding the same grinding object as the grinding object by using the grinding wheel, is determined. Afterwards, since quality of the grinding wheel is detected from a difference between the measured surface area and the reference surface area, the grinding mark caused by the fixed abrasive grain of a large diameter can be easily detected from a change in the surface area of the silicon powder of the silicon sludge.