Title:
キノン硬化型組成物及びこれを含む接着剤組成物
Document Type and Number:
Japanese Patent JP6831007
Kind Code:
B2
Abstract:
The present invention relates to a curable composition and a use thereof and, more particularly, to a curable composition and a use thereof, the curable composition comprising: (a) a compound capable of being denatured to a quinone-based compound by oxygen; (b) an amine-based polymeric compound; and (c) an oxygen clathrate structure. The curable composition is rapidly cured and can be cured not only at an interface of a conventional film but also to the inside of the film, such that the curable composition has uniform physical properties throughout the entire film and excellent physical properties compared to a curing film obtained by curing at an existing interface.
Inventors:
Fan, hong
Han, Jong Suk
Lee, Hye Shin
One, Yunson
Han, Jong Suk
Lee, Hye Shin
One, Yunson
Application Number:
JP2019516205A
Publication Date:
February 17, 2021
Filing Date:
September 27, 2017
Export Citation:
Assignee:
Kolon Industries Inc.
Korea Advanced Institute of Science and Technology
Korea Advanced Institute of Science and Technology
International Classes:
C08L79/02; C08K3/04; C08K3/20; C08K3/36; C08K5/08; C09D7/63; C09D179/02; C09J11/06; C09J179/02
Domestic Patent References:
| JP2002509171A | ||||
| JP2010275178A |
Foreign References:
| US6506577 |
Attorney, Agent or Firm:
Yamashita
Horikawa Kaori
Horikawa Kaori