To provide a resin composition that shows improved resistance to moisture and humidity after cured completely.
The radiation-curable resin composition contains, on the basis of the total weight thereof, (A) 0-29 wt.% cationically curable component having a linking aliphatic ester group and two cyclohexeneoxide groups, (B) 10-85 wt.% epoxy group-containing component other than (A), (C) 1-50 wt.% oxetane group-containing component, for example, a specific oxetane compound having a hydroxy group, an alkoxy group or a phenoxy group via a methylene group, (D) 1-25 wt.% multifunctional acrylate, (E) a radical photoinitiator, and (F) a cationic photoinitiator. The radiation-curable resin composition has (i) 1,000-10,000 MPa flexural modulus when cured completely by actinic radiation and 60 minute UV postcure.
DIAS AYLIN JORGE ANGELO ATHANASIUS
LAWTON JOHN ALAN
WINMILL DAVID L
XU JIGENG
YOU XIAORONG
| JPH10168106A | 1998-06-23 | |||
| JPH11199647A | 1999-07-27 | |||
| JP2000302964A | 2000-10-31 | |||
| JPH09278935A | 1997-10-28 | |||
| JPH0931186A | 1997-02-04 | |||
| JP2002256062A | 2002-09-11 | |||
| JPH10158385A | 1998-06-16 | |||
| JP2000302964A | 2000-10-31 | |||
| JP2003511742A | 2003-03-25 | |||
| JP2001220526A | 2001-08-14 | |||
| JPH10168106A | 1998-06-23 | |||
| JPH11199647A | 1999-07-27 | |||
| JPH09278935A | 1997-10-28 | |||
| JPH0931186A | 1997-02-04 | |||
| JP2002256062A | 2002-09-11 |
Masakazu Noda
Yoshinori Shimizu
Ikeda adult