To provide a resin composition which is free of halogen-based compounds and is excellent in flame retardancy, heat resistance and metal foil peel strength, and a prepreg, a metal clad laminated board and a printed wiring board using the same.
The resin composition contains: (a) a phosphinate represented by formula (1), wherein R1 and R2 may be the same and different from each other and are each a linear or branched 1C-6C alkyl group and/or an aryl group; M is at least one metal selected from the group consisting of Mg, Ca, Al, Sb, Sn, Ge, Ti, Zn, Fe, Zr, Ce, Bi, Sr, Mn, Li, Na and K; and m is an integer of 1-4; (b) a thermosetting resin; and (c) a hardener for the thermosetting resin, wherein the phosphinate (a) has an average particle size of 2-5 μm and a specific surface area of 2.0-4.0 m2/g.
MURAI YASUHIRO
AITSU SHUJI
SHIMIZU HIROSHI
TOMIOKA KENICHI
| JP2002284963A | 2002-10-03 | |||
| JP2004115795A | 2004-04-15 | |||
| JP2006028298A | 2006-02-02 | |||
| JP2006028249A | 2006-02-02 | |||
| JP2003301013A | 2003-10-21 |
| WO2003087230A1 | 2003-10-23 |
Iwa Saki Kokuni
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu