To provide a radiation-curable type adhesive composition that has a crosslinked structure of an acrylic-based polymer which includes therein a movable molecule such as a radiation-curable type compound and besides which has little fluctuation in pick-up characteristics caused by the temperature during transportation or custody, and that has a disperse state of the radiation-curable type compound.

This radiation-curable type adhesive composition includes an acrylic-based polymer, a radiation-curable type compound, a crosslinker, and a photopolymerization initiator, characterized in that the maximum calorific peak temperature in measurement by a differential scanning calorimetry (DSC) is from 140°C or above and less than 180°C, and the shift magnitude at the maximum calorific peak temperature on the DSC after the treatment at 60°C for 24 hours is within 30°C.