Title:
RADIATION-CURING ADHESIVE TAPE FOR DICING
Document Type and Number:
Japanese Patent JP2014072221
Kind Code:
A
Abstract:
To provide a radiation-curing adhesive tape for dicing, capable of easily picking up even a semiconductor chip or the like on which a through electrode is provided, without any residual adhesive in a pickup step.
A radiation-curing adhesive tape 1 for dicing of the present invention has a radiation-curing adhesive layer 3 provided on a base material sheet 2. In the radiation-curing adhesive tape 1, the ratio of a Young's modulus after radiation curing to a Young's modulus before radiation curing is 1.8 or less.
Inventors:
OTA SATOSHI
TAMAGAWA ARIMICHI
YABUKI AKIRA
HATTORI SATOSHI
TAMAGAWA ARIMICHI
YABUKI AKIRA
HATTORI SATOSHI
Application Number:
JP2012214776A
Publication Date:
April 21, 2014
Filing Date:
September 27, 2012
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
H01L21/301; C09J7/22; C09J7/38; C09J201/00
Attorney, Agent or Firm:
Ryo Matsushita
Hashimoto Takako
Hashimoto Takako
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