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Title:
RADIATION SENSITIVE COMPOSITION
Document Type and Number:
Japanese Patent JPH04219757
Kind Code:
A
Abstract:

PURPOSE: To obtain the radiation sensitive positive composition high in sensitivity by using a phenol resin binder soluble not in water but in an alkali and prepared by substituting phenolic hydroxyl groups with acetal groups.

CONSTITUTION: The radiation sensitive composition comprises (a) the binder or its mixture soluble not in water but in an alkali, and (b) a compound to be allowed to form a strong acid by irradiation with radiation. The binder (a) is the phenol resin having 20-70% of its hydroxyl groups substituted by a group represented by the formula in which each of R1 and R2 is an alkyl group; R3 is an H atom or an alkyl group; and each of R1 and R2 may combine with each other together with -(CH2)m- to form ring; and (m) is an integer of 3-6. It is preferred for the phenol resin (a) to have an average molecular weight of 300-20000g/mol, especially, 300-2000g/mol.


Inventors:
ZON GUIEN KIMU
Application Number:
JP4483491A
Publication Date:
August 10, 1992
Filing Date:
March 11, 1991
Export Citation:
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Assignee:
BASF AG
International Classes:
G03F7/004; G03F7/039; H01L21/027; (IPC1-7): G03F7/004; G03F7/023; G03F7/039; H01L21/027
Attorney, Agent or Firm:
Tajiro Taiji