RADIATION SENSITIVE RESIN COMPOSITION FOR INTERLAYER INSULATING FILM

Title:

RADIATION SENSITIVE RESIN COMPOSITION FOR INTERLAYER INSULATING FILM

Document Type and Number:

Japanese Patent JP2000162769

Kind Code:

A

Abstract:

To provide the radiation sensitive resin composition for a material for forming a protective film and the like for use in electronic device parts or the interlayer insulating films, especially adapted to those for a liquid crystal display element and an integrated circuit element and a solid photographing element.

This restrain sensitive resin composition comprises [A] a copolymer of (a1) a polymerizable unsaturated carboxylic acid and/or its anhydride, (a2) a polymerizable unsaturated compound having an epoxy group, and (a3) another polymerizable unsaturated compound, and [B] a polymerizable compound having ethylenically unsaturated bond and [C] a radiation sensitive polymerization initiator.

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Inventors:

OGASAWARA SHOJI
NAKANO TAKANORI
ENDO MASAYUKI

Application Number:

JP34126798A

Publication Date:

June 16, 2000

Filing Date:

December 01, 1998

Export Citation:

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Assignee:

JSR CORP

International Classes:

G03F7/027; G02F1/1333; G03F7/033; (IPC1-7): G03F7/033; G02F1/1333; G03F7/027

Attorney, Agent or Firm:

Masataka Oshima

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