To provide the photosensitive resin composition extremely small in light scattering at the time of exposure and developable with water in a short time by using a specified polyamide resin for a filler polymer.
The photosensitive resin composition comprises the polyamide comprising 40-60 weight % structural units each represented by formula I and 30-50 weight % structural units each represented by formula II and 5-15 weight % structural units each represented by forming III, (thus permitting the polymerized polyamide resin to be used for the filler polymer), and further, the composition contains a monomer having a photo-polymerizable unsaturated bond and a photopolymerization initiator. In formulae I-III, R1 is a ≥5C alkylene group: R2 is a 2-10C hydrocarbon group; R3 is a 1-4C alkylene group or a simple bond; R4 is a 1-4C alkylene group; R5 is a 2-10C hydrocarbon group; and each of R6 and R7 is a methylene group or a simple bond.
FUJIMURA TOSHIAKI
NANHEI MASARU
