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Patent Searching and Data


Title:
RADIATION-SENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2016057414
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having a small iso/dense bias of a resist pattern.SOLUTION: The radiation-sensitive resin composition is to be used for a resist pattern forming method including a step of infrared irradiation, and comprises a polymer having a structural unit including a polycyclic structure, a radiation-sensitive acid generator, and a solvent. The polycyclic structure preferably has polarity. The polycyclic structure is preferably a lactone structure. The polymer preferably has an acid dissociable group.SELECTED DRAWING: None

Inventors:
MOCHIDA KENJI
SHIMA MOTOYUKI
Application Number:
JP2014182791A
Publication Date:
April 21, 2016
Filing Date:
September 08, 2014
Export Citation:
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Assignee:
JSR CORP
International Classes:
G03F7/38; G03F7/038; G03F7/039; H01L21/027
Attorney, Agent or Firm:
Hajime Amano
Yoshinori Ikeda
Hiroshi Ogawa
Koji Ishida
Kazuki Kagami
Yoshiaki Negi
Kenichi Fujinaka