Title:
RADIATION SENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH11242335
Kind Code:
A
Abstract:
To provide a radiation sensitive resin compsn. excellent particularly in preservable stability, transparency to radiation, resolution and dry etching resistance as a chemical amplification type resist and excellent also in sensitivity, developability and a pattern shape.
This radiation sensitive resin compsn. contains an alkali-insoluble or slightly alkali-soluble resin having repeating units represented by formula and a radiation sensitive acid generating agent. In the formula R1-R5 are each independently H, 1-6C linear or branched alkyl or 5- to 8-membered cycloalkyl, R1 and R2 may bond to each other to form 5- to 8-membered cycloalkyl or R3 and R4 may bond to each other to form 5- to 8-membered cycloalkyl and (n) is an integer of 0-3.
Inventors:
SUWA MITSUFUMI
IWAZAWA HARUO
YAMAMOTO MASASHI
KAJITA TORU
IWAZAWA HARUO
YAMAMOTO MASASHI
KAJITA TORU
Application Number:
JP6038198A
Publication Date:
September 07, 1999
Filing Date:
February 26, 1998
Export Citation:
Assignee:
JSR CORP
International Classes:
G03F7/004; C08F32/00; C08L45/00; C09D145/00; G03F7/038; H01L21/027; (IPC1-7): G03F7/038; C08F32/00; C08L45/00; G03F7/004; H01L21/027
Attorney, Agent or Firm:
Toshiaki Fukuzawa
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