To allow automatic mounting, unify the attitudes of light guide plates in the mounted state, and reduce the thickness of a device by providing horizontal mounting sections horizontally extended by the prescribed length at terminal sections.

Horizontal mounting sections 42a extended outward from the edge sections of light guide plates in response to the height of the bottom face of a light guide plate 2 are provided at the terminal sections 42 of a luminescence device 40, and a rear lighting system 10 is plane-mounted to a circuit board 60 via the mounting sections 42 a by the solder reflow method. The lighting system 10 can be automatically mounted to the circuit board 60. The vertical height of the mounting sections 42a substantially corresponds to the bottom face of the light guide plate 2, the attitude of the light guide plate 2 can be unified when it is mounted to the circuit board 60, the thickness of the lighting system 10 including the circuit board 60 can be shrunk, and the lighting system 10 more suitable for a small electronic apparatus display device can be obtained.