To provide a recovering method and device of slurry, recovering useful used slurry at high concentration and high recovery rate with a simple device by using a difference in viscosity and a difference in used amount between the slurry and cleaning water.
The method recovers the slurry used in a polishing device, in which a polishing process using slurry and a cleaning process using cleaning water are repeatedly performed at predetermined timings. A slurry drain recovering pipe having a slurry catching pocket catching the slurry flowing down an inner wall, is attached into a common discharge hole for the slurry and cleaning water of the polishing device, so that the slurry flowing down the inner wall of the slurry drain recovering pipe is recovered through the slurry collecting pocket. The drain containing the cleaning water is recovered by using a whole slurry drain recovering pipe.
| JP2000354954 | SEMICONDUCTOR SUBSTRATE POLISHING DEVICE |
| JPH1148147 | LIQUID USING DEVICE AND TREATMENT METHOD OF WAFER BY USING IT |
| JP7108450 | Polishing equipment |
DATE TSUKASA
HIOKI MASAJI
KOJIMA SENRI
| JPH11254298A | 1999-09-21 | |||
| JPS62148158A | 1987-07-02 | |||
| JP2000246625A | 2000-09-12 | |||
| JP2004255531A | 2004-09-16 | |||
| JP2000117635A | 2000-04-25 | |||
| JP2007319974A | 2007-12-13 |
Yukio Kawahara
Satoshi Yamashita
Hideaki Suyama