Title:
REINFORCED PLASTIC FOR SUPERLOW TEMPERATURE USE
Document Type and Number:
Japanese Patent JPS5681329
Kind Code:
A
Abstract:
PURPOSE: Titled resin composition which does not crack even at superlow temperatures (below about -100°C) and has practically sufficient rigidity at normal temperature, prepared by compounding a resin component having a specified composition with glass fiber.
CONSTITUTION: Titled composition prepared by compounding (A) a resin component comprising 55W85wt% of an unsaturated epoxy compound and/or unsaturated polyester compound having one ethylenically unsaturated bond per 500W1,000 of average MW and 45W15wt% of a polymerizable monomer such as styrene or acrylic acid and (B) glass fiber such as roving cloth, said component B being present in an amount of 50W80wt% based on the total.
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Inventors:
KAMIMURA AKIRA
Application Number:
JP15831879A
Publication Date:
July 03, 1981
Filing Date:
December 06, 1979
Export Citation:
Assignee:
UNYUSHIYOU SENPAKU GIJUTSU KEN
International Classes:
B32B1/02; C08F290/00; C08F299/02; C08F299/04; C08G59/00; C08K7/14; C08F299/00; C08L63/00; C08L63/10; C08L67/00; C08L67/06; F17C5/00; (IPC1-7): B32B1/02; C08F299/02; C08K7/14; C08L63/10; C08L67/06; F17C5/00
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