Title:
リモコンセンサ
Document Type and Number:
Japanese Patent JP4761493
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve the problem of the circuit part in a sealed resin being oppressed due to clipping with a hook or the sealing resin deteriorates under high temperature when soldering, related to a surface-mounting type package of a remote control sensor for detecting the infrared rays from a remote controller, where the side surface of sealing resin of the circuit part is clipped by the hook part of a shielding case and further it is fixed by soldering. SOLUTION: An arm part 3d is provided on both sides of a shield case 3, and the profile of a circuit board 1 is provided with a recessed part 1a. The circuit board filled with a sealing resin 2 is capped by a shield case, and the tip of the arm part is bent toward the inside of the recessed part. The sealing resin covers the recessed part as a ceiling, and since the tip of arm part engages with the lower surface of the sealing resin, the shield case is held at the upper part so as not to come off. The engagement in terms of figure will not oppress the sealing resin under elastic force, and soldering is not required, so the number of processes is decreased, and neither will it be subjected to high temperatures. A solder-free effect on the environment is provided as well.
Inventors:
Harumi Watanabe
Application Number:
JP2001222338A
Publication Date:
August 31, 2011
Filing Date:
July 23, 2001
Export Citation:
Assignee:
Citizen Electronics Co., Ltd.
International Classes:
H01L31/02; H04B10/00; H04B10/40; H04B10/50; H04B10/60; H04N5/00; H04Q9/00; H05K9/00
Domestic Patent References:
| JP1092771A | ||||
| JP11131283A | ||||
| JP7263892A | ||||
| JP4328903A | ||||
| JP497361U |
Attorney, Agent or Firm:
Gojong Hiroaki