Title:
REMOVER COMPOSITION OF RESIN WAX FILM LAYER AND METHOD FOR REMOVING THE SAME
Document Type and Number:
Japanese Patent JP2006342312
Kind Code:
A
Abstract:
To provide a remover composition of resin wax film layer excellent in removing performance of the resin wax film layer on a floor face and easily removing the resin wax film layer in a preferable working circumstances and to provide a method for removing the same.
The resin wax removing composition comprises limonen and an aqueous solvent composed of at one selected from 1-methoxy-2-propanol and 1-ethoxy-2-propanol or a mixture thereof. The preferable formulation is 1-50 wt.%. of the limonen and 50-99 wt.%. of the aqueous solvent. The method for removing the resin wax film layer comprises application of the remover composition and then crushing the destructible solid resin wax film layer and removing.
Inventors:
YAMANAKA MINORU
Application Number:
JP2005196776A
Publication Date:
December 21, 2006
Filing Date:
June 07, 2005
Export Citation:
Assignee:
RISUDAN CHEMICAL KK
ASAHI KASEI CHEMICALS CORP
ASAHI KASEI CHEMICALS CORP
International Classes:
C09D9/00; C11D7/24; C11D7/26; C11D7/50
Attorney, Agent or Firm:
Junzo Yamauchi
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