Title:
A method of repairing or reinforcing a structure using an adhesive sheet, a method of manufacturing a structure repaired or reinforced using an adhesive sheet, an adhesive sheet
Document Type and Number:
Japanese Patent JP6337959
Kind Code:
B2
Abstract:
There is provided a method for repairing or reinforcing a structure. The method includes the steps of: providing an adhesive sheet comprising an adhesive layer comprising at least a curable resin composition whose curing is promoted by irradiation with ionizing radiation and a curing aid which generates a basic substance by irradiation with ionizing radiation; attaching the adhesive sheet to a surface of the structure; and curing the adhesive layer of the adhesive sheet in a state where the adhesive layer is exposed.
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| JP2023081331 | ADHESIVE LAYER AND/OR BONDING AGENT LAYER |
Inventors:
Kentaro Hoshi
Takahisa Taniguchi
Tomoyuki Tachikawa
Takahisa Taniguchi
Tomoyuki Tachikawa
Application Number:
JP2016513717A
Publication Date:
June 06, 2018
Filing Date:
April 03, 2015
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
C09J5/00; C09J5/02; C09J7/10; C09J11/06; C09J163/00; C09J201/00; E04G23/02
Domestic Patent References:
| JP8218646A | ||||
| JP2004137797A | ||||
| JP2006102738A |
Foreign References:
| WO2014007341A1 |
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Mari Asano
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Mari Asano
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