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Patent Searching and Data


Title:
RESILIENT BODY FOR WET POLISHING
Document Type and Number:
Japanese Patent JPH1086069
Kind Code:
A
Abstract:

To provide a resilient body for a wet polishing, which can prevents seeping of an abrasive and perform an efficient and uniform polishing with a small amount of the abrasive.

The resilient body for a wet polishing is formed by winding a thermoplastic resin film 2 such as a polyethylene film on a resilient body 1 such as a closed cell type of polyethylene foam. The overlapping portion 4 at the end part of the thermoplastic resin film 2 is fixed by an adhesive tape or the like. And a liquid abrasive is applied to a predetermined location of the thermoplastic resin film 2 so that an object to be polished such as a coated steel sheet is wet-polished at that location.


Inventors:
Harada, Hirobumi
Application Number:
JP1996000240247
Publication Date:
April 07, 1998
Filing Date:
September 11, 1996
Export Citation:
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Assignee:
TAKEHARA:KK
International Classes:
B24D15/00; (IPC1-7): B24D15/00
Attorney, Agent or Firm:
恩田 博宣