Title:
RESIN COMPOSITION, ELECTRIC/ELECTRONIC COMPONENT ENCAPSULATED BODY USING THE RESIN COMPOSITION, AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2014224272
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition exhibiting a favorable adhesiveness to olefins such as a crosslinked polyethylene-coated electric cable, polypropylene, etc. and also exhibiting a favorable adhesiveness to PET, PBT, and glass-epoxy (glass cloth-based epoxy resin substrate).SOLUTION: The provided resin composition for an encapsulated body includes, in a case where the entirety of the resin composition is defined as 100 wt.%, 20-70 wt.% of a polymer including a propylene chain as a main component, 20-70 wt.% of a polymer including an ethylene chain as a main component, 5-40 wt.% of an acid-modified olefin, and 5-45 wt.% of a crystalline copolymerized polyester in a state where the crystalline copolymerized polyester possesses ether bonds and has a glass transition point of 0°C or below.
Inventors:
NAKAJIMA NAOSHI
Application Number:
JP2014175028A
Publication Date:
December 04, 2014
Filing Date:
August 29, 2014
Export Citation:
Assignee:
TOYO BOSEKI
International Classes:
C08L23/10; C08L23/04; C08L23/26; C08L67/00; H01L23/29; H01L23/31
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