Title:
RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
Japanese Patent JP3867987
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition which is developed with water, achieves good pattern accuracy, ensures little residue of organic matter after baking by heating, and is used chiefly for a resistive element pattern excellent in adhesion, and also to provide a cured product thereof.
SOLUTION: The resin composition comprises a polymer (A) of a specified structure obtained using a compound of formula (1) (where R1 is H or methyl; R2 is H or alkyl; and n is an integer of 2-10) as starting material, a diluent (B), a photopolymerization initiator (C) and one or more kinds (D) selected from metal powder, a metal oxide, and glass. The cured product thereof is also provided.
Inventors:
Moriakira
Minoru Yokoshima
Minoru Yokoshima
Application Number:
JP2004335822A
Publication Date:
January 17, 2007
Filing Date:
November 19, 2004
Export Citation:
Assignee:
NIPPON KAYAKU KABUSHIKI KAISHA
International Classes:
G03F7/033; C08K3/00; C08L5/00; C08L33/06; G03F7/004; (IPC1-7): G03F7/033; C08K3/00; C08L5/00; C08L33/06; G03F7/004
Domestic Patent References:
| JP2165538A | ||||
| JP57049105A | ||||
| JP2268870A | ||||
| JP6260083A |
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