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Title:
RESIN COMPOSITION FOR ELECTRODEPOSITION COATING
Document Type and Number:
Japanese Patent JP2000234077
Kind Code:
A
Abstract:

To obtain a resin composition which is excellent in storage stability and can form a coating film excellent in corrosionproofness and low-temperature curability by compounding a hydroxyl-containing resin with a polyisocyanate compound blocked with an amidoalcohol having alcoholic hydroxyl group.

This composition contains a hydroxyl-containing resin, which is preferably an amine-added hydroxyl-containing epoxy resin, and a polyisocyanate compound blocked with an amidoalcohol preferably having at least one amide bond and at least one alcoholic hydroxyl group. Preferably, the amidoalcohol is selected from among compounds represented by formulas: R1-CONH-R2-OH and HO-R3-CONH-R4 and/or has a mol.wt. of 400 or lower. In the formulas, R1 and R4 are each 1-4C alkyl; and R2 and R3 are each 1-4C alkylene. Preferably, the composition is cationic.


Inventors:
NISHIGUCHI JIRO
HIRATO SHINJI
NISHIDA REIJIRO
Application Number:
JP35718999A
Publication Date:
August 29, 2000
Filing Date:
December 16, 1999
Export Citation:
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Assignee:
KANSAI PAINT CO LTD
International Classes:
C08G18/58; C08G18/80; C09D5/44; C09D175/04; (IPC1-7): C09D175/04; C09D5/44
Domestic Patent References:
JPH09328639A1997-12-22
JPH041278A1992-01-06
JPS62285911A1987-12-11
JPS59161424A1984-09-12
Attorney, Agent or Firm:
Heiyoshi Odashima (3 outside)